SMT Glue

SMT Glue is formulated for electronic applications, offering controlled flow properties and strong adhesion to ensure stable component placement on PCBs while maintaining bonding integrity during high-temperature soldering processes.
Uses
Used in PCB assembly, electronics manufacturing, chip mounting processes, automated production lines, and wave soldering applications in electronic industries.
Benefits
Provides strong adhesion, excellent thermal stability, controlled viscosity for precise dispensing, and reliable bonding performance during soldering processes.
.dc-scroll-wrap2{
width:100%;
overflow-x:auto;
-webkit-overflow-scrolling:touch;
margin:8px 0 14px;
}
.dc-scroll-table2{
width:100%;
min-width:520px;
border-collapse:collapse;
font-family:Roboto, Arial, sans-serif;
border:1px solid #e7e7e7;
background:#fff;
}
.dc-scroll-title2{
font-family:Roboto, Arial, sans-serif;
font-size:15px;
font-weight:700;
margin:8px 0 6px;
padding-left:8px;
border-left:4px solid #01CD61;
color:#111827;
}
.dc-scroll-table2 td{
padding:7px 10px;
border-bottom:1px solid #e7e7e7;
font-size:12.5px;
line-height:1.35;
vertical-align:top;
}
.dc-scroll-table2 tr:last-child td{
border-bottom:none;
}
.dc-scroll-label2{
width:220px;
min-width:220px;
font-weight:700;
font-size:11.5px;
color:#6b7280;
text-transform:uppercase;
letter-spacing:.2px;
}
.dc-scroll-value2{
min-width:260px;
color:#111827;
}
Safety, Compliance & Notes
Thermal Conductivity
~0.20 W/m·K
Electrical Conductivity
Very low
Heat of Formation
Not defined
Heat of Vaporization
Not defined
Structure
Epoxy / acrylic-based adhesive formulation
CAS Number
Mixture
EINECS Number
Not applicable
Storage & Packaging
Store in refrigerated conditions (2–8°C) to maintain shelf life.
Product Stewardship
Use PPE, avoid contamination, follow electronic handling standards.
Note
Viscosity and curing profile depend on formulation.
Notice
Test before mass production to ensure compatibility.